TPS54331 3A, 28V INPUT, STEP DOWN SWIFT™ DC/DC CONVERTER WITH ECO-MODE

TPS54331 3A, 28V INPUT, STEP DOWN SWIFT™ DC/DC CONVERTER WITH ECO-MODE

1FEATURES
2• 3.5V to 28V Input Voltage Range
• Adjustable Output Voltage Down to 0.8V
• Integrated 80 mΩ High Side MOSFET Supports
up to 3A Continuous Output Current
• High Efficiency at Light Loads with a Pulse
Skipping Eco-mode™
• Fixed 570kHz Switching Frequency
• Typical 1μA Shutdown Quiescent Current
• Adjustable Slow Start Limits Inrush Currents
• Programmable UVLO Threshold
• Overvoltage Transient Protection
• Cycle-by-Cycle Current Limit, Frequency Fold
Back and Thermal Shutdown Protection
• Available in Easy-to-Use SOIC8 Package or
Thermally Enhanced SOIC8 PowerPADTM
Package
• Supported by SwitcherPro™ Software Tool
(http://focus.ti.com/docs/toolsw/folders/print/s
witcherpro.html)
• For SWIFT™ Documentation, See the TI
Website at www.ti.com/swift

APPLICATIONS
• Consumer Applications such as Set-Top
Boxes, CPE Equipment, LCD Displays,
Peripherals, and Battery Chargers
• Industrial and Car Audio Power Supplies
• 5V, 12V and 24V Distributed Power Systems

DESCRIPTION
The TPS54331 is a 28-V, 3-A non-synchronous buck
converter that integrates a low RDS(on) high side
MOSFET. To increase efficiency at light loads, a
pulse skipping Eco-mode™ feature is automatically
activated. Furthermore, the 1 μA shutdown supply
current allows the device to be used in battery
powered applications. Current mode control with
internal slope compensation simplifies the external
compensation calculations and reduces component
count while allowing the use of ceramic output
capacitors. A resistor divider programs the hysteresis
of the input under-voltage lockout. An overvoltage
transient protection circuit limits voltage overshoots
during startup and transient conditions. A cycle by
cycle current limit scheme, frequency fold back and
thermal shutdown protect the device and the load in
the event of an overload condition. The TPS54331 is
available in 8-pin SOIC package and 8-pin SOIC
PowerPADTM package that have been internally
optimized to improve thermal performance.

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